Hole specifications
Plated through-hole according to IEC 60352-5
| Grid 5.08 x 10.16 mm | Grid 5.08 x 7.62 mm | |||
| Nominal hole | Ø 1.45 mm | Ø 1.6 mm | ||
| imm. Sn printed circuit boards | ||||
 | A | PCB thickness | min. 2.9 mm | min. 2.9 mm |
| B | Plated hole | Ø 1.45 +0.09/-0.06 mm | Ø 1.6 +0.09/-0.06 mm | |
| C | Drill hole | 1.6 ±0.025 mm | 1.75 ±0.025 mm | |
| D | Cu plating | min. 25 µm | min. 25 µm | |
| E | imm. Sn plating | max. 1.5 µm | max. 1.5 µm | |
| F | Annular ring | min. 0.1 mm | min. 0.1 mm | |
| Ni, Au printed circuit boards | ||||
| A | PCB thickness | min. 2.9 mm | min. 2.9 mm | |
| B | Plated hole | Ø 1.45 +0.09/-0.06 mm | Ø 1.6 +0.09/-0.06 mm | |
| C | Drill hole | 1.6 ±0.025 mm | 1.75 ±0.025 mm | |
| D | Cu plating | min. 25 µm | min. 25 µm | |
| E | Ni, Au plating | 0.05 - 0.2 µm Au over 2.5 - 5 µm Ni | 0.05 - 0.2 µm Au over 2.5 - 5 µm Ni | |
| F | Annular ring | min. 0.1 mm | min. 0.1 mm | |
| HAL Sn printed circuit boards | ||||
| A | PCB thickness | min. 2.9 mm | min. 2.9 mm | |
| B | Plated hole | Ø 1.45 +0.09/-0.06 mm | Ø 1.6 +0.09/-0.06 mm | |
| C | Drill hole | 1.6 ±0.025 mm | 1.75 ±0.025 mm | |
| D | Cu plating | min. 25 µm | min. 25 µm | |
| E | HAL Sn | 5 - 15 µm | 5 - 15 µm | |
| F | Annular ring | min. 0.1 mm | min. 0.1 mm | |