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ept GmbH
Bergwerkstr. 50,
86971 Peiting, Germany
Tel.  +49 (0) 88 61 / 25 01 0 | Fax  +49 (0) 88 61 / 55 07
www.ept.de



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Hole specifications





AMC signal connector for AdvancedTCA and MicroTCA

Plated through-hole according to IEC 60352-5

  Nominal hole
Ø 0.55 mm
 imm. Sn printed circuit boards
A
PCB thickness
min. 1.4 mm
BPlated hole
Ø 0.55 ±0.05 mm
CDrill hole
Ø 0.64 ±0.01 mm
DCu platingmin. 25 µm
Eimm. Sn platingmax. 1.5 µm
FAnnular ring
min. 0.15 mm
Ni, Au printed circuit boards
APCB thickness
min. 1.4 mm
BPlated hole
Ø 0.55 ±0.05 mm
CDrill hole
Ø 0.64 ±0.01 mm
DCu platingmin. 25 µm
ENi, Au plating0.05 - 0.2 µm Au
over 2.5 - 5 µm Ni
FAnnular ring
min. 0.15 mm
     

AdvancedTCA power male connector

Plated through-hole according to IEC 60352-5

  Nominal hole
Ø 1.0 mm
Ø 1.6 mm
 imm. Sn printed circuit boards
A
PCB thickness
min. 1.4 mm
min. 1.4 mm
B
Plated hole
Ø 1 +0.09/-0.06 mm
Ø 1.6 +0.09/-0.06 mm
C
Drill hole
Ø 1.15 ±0.025 mm
Ø 1.75 ±0.025 mm
D
Cu plating
min. 25 µm
min. 25 µm
E
imm. Sn plating
max. 1.5 µm
max. 1.5 µm
F
Annular ring
min. 0.1 mm
min. 0.1 mm
Ni, Au printed circuit boards
A
PCB thickness
min. 1.4 mm
min. 1.4 mm
B
Plated hole
Ø 1 +0.09/-0.06 mm
Ø 1.6 +0.09/-0.06 mm
C
Drill hole
Ø 1.15 ±0.025 mm
Ø 1.75 ±0.025 mm
D
Cu plating
min. 25 µm
min. 25 µm
E
Ni, Au plating
0.05 - 0.2 µm Au
over 2.5 - 5 µm Ni
0.05 - 0.2 µm Au
over 2.5 - 5 µm Ni
F
Annular ring
min. 0.1 mm
min. 0.1 mm
 
   

AdvancedTCA power female connector

Plated through-hole according to IEC 60352-5

  Nominal hole
Ø 1.0 mmØ 1.6 mm
 imm. Sn printed circuit boards
A
PCB thickness
min. 2.9 mmmin. 2.9 mm
B
Plated hole
Ø 1 +0.09/-0.06 mm
Ø 1.6 +0.09/-0.06 mm
C
Drill hole
Ø 1.15 ±0.025 mmØ 1.75 ±0.025 mm
D
Cu plating
min. 25 µmmin. 25 µm
E
imm. Sn plating
min. 1.5 µmmin. 1.5 µm
F
Annular ring
min. 0.1 mm
min. 0.1 mm
Ni, Au printed circuit boards
A
PCB thickness
min. 2.9 mm
min. 2.9 mm
B
Plated hole
Ø 1 +0.09/-0.06 mm
Ø 1.6 +0.09/-0.06 mm
C
Drill hole
Ø 1.15 ±0.025 mm
Ø 1.75 ±0.025 mm
D
Cu plating
min. 25 µm
min. 25 µm
E
Ni, Au plating
0.05 - 0.2 µm Au
over 2.5 - 5 µm Ni
0.05 - 0.2 µm Au
over 2.5 - 5 µm Ni
F
Annular ring
min. 0.1 mm
min. 0.1 mm
    

MicroTCA power (backplane and power module output)

Plated through-hole according to IEC 60352-5

  Nominal hole
Ø 0.60 mm
 imm. Sn printed circuit boards
A
PCB thickness
min. 1.4 mm
B
Plated hole
Ø 0.60 ±0.05 mm
C
Drill hole
Ø 0.70 ±0.02 mm
D
Cu plating
min. 25 µm
E
imm. Sn plating
max. 1.5 µm
F
Annular ring
min. 0.1 mm
Ni, Au printed circuit boards
A
PCB thickness
min. 1.4 mm
B
Plated hole
Ø 0.60 ±0.05 mm
C
Drill hole
Ø 0.70 ±0.02 mm
D
Cu plating
min. 25 µm
E
Ni, Au plating
0.05 - 0.2 µm Au
over 2.5 - 5 µm Ni
F
Annular ring
min. 0.1 mm