Hole specifications
ept offers adapted press-fit zones for various new board surfaces.
Plated through-hole according to IEC 60352-5
| Nominal hole | Ø 0.6 mm | ||
| imm. Sn printed circuit boards | |||
 | A | PCB thickness | min. 1.4 mm |
| B | Plated hole | Ø 0.60 ±0.05 mm | |
| C | Drill hole | 0.70 ±0.02 mm | |
| D | Cu plating | min. 25 µm | |
| E | imm. Sn plating | max. 1.5 µm | |
| F | Annular ring | min. 0.1 mm | |
| Ni, Au printed circuit boards | |||
| A | PCB thickness | min. 1.4 mm | |
| B | Plated hole | Ø 0.60 ±0.05 mm | |
| C | Drill hole | 0.70 ±0.02 mm | |
| D | Cu plating | min. 25 µm | |
| E | Ni, Au plating | 0.05 - 0.2 µm Au over 2.5 - 5 µm Ni | |
| F | Annular ring | min. 0.1 mm | |
| pure Cu printed circuit boards | |||
| A | PCB thickness | min. 1.4 mm | |
| B | Plated hole | Ø 0.60 ±0.05 mm | |
| C | Drill hole | 0.70 ±0.02 mm | |
| D | Cu plating | min. 25 µm | |
| E | OSP* | e.g. GLICOAT-SMD (F2) with 0.12 - 0.15 µm | |
| F | Annular ring | min. 0.1 mm | |
| HAL Sn printed circuit boards | |||
| A | PCB thickness | min. 1.4 mm | |
| B | Plated hole | Ø 0.60 ±0.05 mm | |
| C | Drill hole | 0.70 ±0.02 mm | |
| D | Cu plating | min. 25 µm | |
| E | HAL Sn | 5 - 15 µm | |
| F | Annular ring | min. 0.1 mm | |
* OSP = Organic Solderability Preservatives