ept – Through-Hole-Technology-Reflow (THTR)
Everything in one processDespite having different names ((THTR, THR, THT, PiP, PIHIR ...), the term THTR (Through-Hole-Technology-Reflow) describes the following procedure in terms of production technology: solder paste is not only applied by means of screen printing to the pads on the components to be mounted onto the surfaces; it is also applied to the through-plated holes for the components.
For example, connectors are inserted into the through-plated holes with the solder paste during assembly. The solder paste is then soldered to the contact pins of the connector during the heating process in the reflow oven. Slits, especially integrated into the connectors, ensure that heat convection is optimal.